RBI-BISIH launch G20 TechSprint to improve cross-border payments
Published
Under India’s G20 Presidency, the RBI and the BIS Innovation Hub (BISIH) of the Bank for International Settlements have jointly launched the fourth edition of the G20 TechSprint, a global technology competition to promote innovative solutions aimed at improving cross-border payments.
RBI and BIS have invited global innovators to help develop innovative technology solutions for cross-border payments. The competition is open to developers from around the world for submitting application from May 4, 2023, to June 4, 2023, and the TechSprint will conclude around August/ September 2023.
The 2023 TechSprint will focus on three problem statements on cross-border payments formulated by RBI and the BISIH:
AML/CFT/Sanctions technology solutions to reduce illicit finance risk.
FX and liquidity technology solutions to enable settlement in emerging market and developing economy (EMDE) currencies.
Technology solutions for multilateral cross-border CBDC platforms.
An independent panel of experts will select the most promising solution to each problem statement from the shortlisted solutions, to be announced at a final event in August/ September 2023. The winners for each problem statement will receive an award of Rs 40,00,000. For more information visit the competition page https://hackolosseum.apixplatform.com/h1/g20techsprint2023.